By Dobrivojie Popovich
ISBN-10: 0824702263
ISBN-13: 9780824702267
Offers a scientific and entire review to the idea and functions of mechatronic processes—emphasizing the variation and incorporation of this significant instrument to satisfy wanted functionality and caliber specifications. Addresses the center applied sciences wanted for the layout and improvement of the mechatronic product, covers layout methods, discusses similar mechatronic product layout elements, and info mechatronic product software examples.
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Extra resources for Mechatronics in Engineering Design and Product Development
Sample text
Since part of the heat entering the volume by conduction is removed by the fluid, the heat-flux density on the upper side is smaller than that on the lower side. Since the conduction heat-flux density is related to the thermal gradient, it is clear that ∂T/∂y decreases as we move away from the plate. The shape of the temperature profile depends on the hydrodynamic conditions and on the properties of the fluid—density, specific heat, and viscosity. In laminar-flow systems, it is possible to develop theoretical models that allow one to calculate the partial derivative of Eq.
In the free space, air is enclosed. The temperature differences between fibers create interior natural convection streams that originate the second heat transfer mechanism. The size, shape, and orientation of these hollow spaces affect the convection heat transmission through the insulation. It is convenient to create small cells to limit air movement. This means that the higher the material density, the lower will be the convection contribution to heat transfer (the opposite of conduction). As explained previously, another way to reduce convection is vacuum insulation, but this is not practicable in most cases.
3-2-17) and (3-2-18) making an analogy with an electric circuit in which the heat flux is analogous to the electric current, the temperature difference acts as potential difference, and U is the reciprocal of the resistance. Then each term within the parentheses can be considered as a partial resistance representing any of the solid-fluid interfaces or any material layer. All these resistance are in series, and the total resistance is the sum of the partial resistances. Frequently, one of these resistances is much smaller than the others and can be neglected without causing an appreciable error in the calculations.
Mechatronics in Engineering Design and Product Development by Dobrivojie Popovich
by Jeff
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