Read e-book online Integrated Interconnect Technologies for 3D Nanoelectronic PDF

By Muhannad S Bakir, Professor James D Meindl

ISBN-10: 1596932465

ISBN-13: 9781596932463

ISBN-10: 1596932473

ISBN-13: 9781596932470

Latest microchips have approximately reached their functionality limits. quite a few warmth removing, strength supply, chip reliability, and input/output (I/O) signaling difficulties stand within the approach of next-generation 3D gigascale, system-on-a-chip expertise, and this state-of-the-art advisor describes the newest breakthroughs in microfluidics, high-density compliant electric interconnects, and nanophotonics which are converging to resolve them. Engineers get complete info on cutting-edge I/O interconnects and packaging, besides the most recent advances and purposes in energy supply layout, research, and modeling. The publication explores interconnect buildings, fabrics, and programs for reaching high-bandwidth off-chip electric verbal exchange. It brings readers in control with the newest warmth removing applied sciences together with chip-scale microchannel cooling, built-in micropumps and fluidic channels, and carbon nanotube interconnects.

Show description

Read Online or Download Integrated Interconnect Technologies for 3D Nanoelectronic Systems PDF

Best media books

New PDF release: Searching for Dave Chappelle

In 2005, Dave Chappelle left convey company on the top of his reputation, giving up a small fortune and the most popular new tv exhibit in lots of years. In so doing, he remodeled from being one of many maximum comics of his iteration into some of the most enigmatic ever. In looking for Dave Chappelle, Jason Zinoman, the 1st comedy critic within the historical past of the recent York occasions, varieties throughout the myriad theories and examines what occurred to this singular artist.

Read e-book online Essential Silverlight 2 Up-to-Date PDF

Layout wealthy web purposes (RIAs) for the net utilizing Silverlight 2, Microsoft's sizzling runtime software. to be had simply as an book, this concise, easy-to-understand creation offers entire step by step directions for utilizing every thing Silverlight 2 has to provide, together with instruments for animation, vector pix, video playback, .

Download PDF by Jeff Scanlon: Accelerated Silverlight 2 (Accelerated)

Silverlight 2 is a brand new net improvement know-how from Microsoft that's already inflicting large waves in the improvement neighborhood. it's the normal successor to Ajax and ASP. internet AJAX-style purposes and offers a way for web-pages to supply the seamless and wealthy consumer event that's at present in basic terms on hand from desktop-based purposes.

Download e-book for kindle: Exploring Media Culture: A Guide by Michael Real

This targeted textbook offers a clean interpretation of media research and cultural stories. every one bankruptcy makes a speciality of a specific element of yank pop culture - together with Hollywood cinema, presidential elections and the large Bowl - to demystify advanced thoughts corresponding to ritual, postmodernism and political economic system.

Additional info for Integrated Interconnect Technologies for 3D Nanoelectronic Systems

Example text

1 (see Chapter 11). It is clear that the size of the heat sink has been increasing with each new microprocessor, thus imposing limits on system size, chip packing efficiency, and interconnect length between chips. While the minimum feature size of a silicon transistor has been decreasing, the thermal I/O (heat sink) has scaled in the opposite direction in order to attain smaller junction-to-ambient thermal resistance (Rja). 2°C/W [24]. 03 m/s; no heat sink was needed for the Intel 386 microprocessor to operate at the needed chip junction temperature because of the small power dissipation [32].

The role of β is often considered secondary compared to that of α and sometimes ignored for simplicity. 1 Channel Cracking A tensile stress in an elastic film can cause cohesive fracture by channel cracking. Unlike a freestanding sheet, fracture of the film bonded to a substrate is constrained. 11 [23, 41]. 12(b) shows the cross section in the wake of a channel crack [42]. 7) where σ f is the tensile stress in the film, hf is the film thickness, and the dimensionless coefficient Z depends on the elastic mismatch between the film and the substrate.

9) thin-film structure. The measured interface toughness in general exhibits a trend to increase as the phase angle increases. It is understood that the shearing mode promotes inelastic deformation in the constituent materials and near-tip interface contact/sliding, both contributing to the energy dissipation during the crack growth [31]. The measurements of interface fracture toughness provide a tool for materials selection and process control in the microelectronics industry. One typically measures the fracture toughness for specific interfaces under various process conditions, then selects the material and condition that gives an adequate toughness.

Download PDF sample

Integrated Interconnect Technologies for 3D Nanoelectronic Systems by Muhannad S Bakir, Professor James D Meindl


by Thomas
4.4

Rated 4.51 of 5 – based on 19 votes